Press Fit BGA Electronics Blind Buried Via PCB Prototyping

FOB Price: US $0.1-0.9 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $0.1-0.9/ Piece
Port: Shenzhen, China
Production Capacity: 60000sqm/Year
Payment Terms: T/T, D/P, Western Union, Paypal
Press Fit BGA Electronics Blind Buried Via PCB Prototyping

Basic Info

Product Description

  • Model NO.: HH-55
  • Dielectric: FR-4
  • Application: Motherboard
  • Mechanical Rigid: Rigid
  • Base Material: Copper
  • Brand: Huihe Circuits
  • Accreditations: ISO9001/UL/SGS/RoHS
  • Min. Hole Diameter: 0.2mm
  • Board Thickness: 2.0mm
  • Trademark: E358408
  • Origin: Shenzhen, China
  • Type: Rigid Circuit Board
  • Material: Fiberglass Epoxy
  • Flame Retardant Properties: V0
  • Processing Technology: Electrolytic Foil
  • Insulation Materials: Organic Resin
  • Leadtime: 10 Working Days
  • Min. Line W/S: 4/4mil
  • Aspect Ratio: 6.6:1
  • Surface Finish: Enig
  • Transport Package: Vacuum Package in Cartons
  • HS Code: 853400900

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Mr. Nemo Lee

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